Semiconductor devices are getting smaller and smaller, along with the markings that they carry, it must be applied with a high degree of precision. Since most components are microscopically small, the data contained in the marking seldom exceeds the micrometer range. The possible contents of markings ranges from manufacturing and tracing codes to simple alphanumeric characters and complex 2D codes, logos and customized data.
Micro soldering
Micro soldering in the semiconductor Industry
The system is designed for ease of use and equipped with latest green & clean technology by using a non-contact laser soldering with flux-free solderball.
Applications
Camera Module soldering - OIS, AF and more
Voice Coil Motor (VCM) soldering
Heat Sensitive Components soldering
Hard Disc Drive (HDD) HGA level soldering
The system is designed for ease of use and equipped with latest green & clean technology by using a non-contact laser soldering with flux-free solderball.
Applications
Camera Module soldering - OIS, AF and more
Voice Coil Motor (VCM) soldering
Heat Sensitive Components soldering
Hard Disc Drive (HDD) HGA level soldering
Related Product Families
Laser Marking
Laser Marking in the semiconductor Industry
There are two major technologies used for marking of electronic devices – pad printing and direct laser marking. Many exposed silicon packages are used in memory applications, and direct laser marking has been widely accepted in this part of the industry as the best solution for these devices.
There are two major technologies used for marking of electronic devices – pad printing and direct laser marking. Many exposed silicon packages are used in memory applications, and direct laser marking has been widely accepted in this part of the industry as the best solution for these devices.
Related Product Families
